CONFERENCE DATES

6-7 July 2022

Welcome to I3D22

The I3D Conference discusses the cutting edge advances on the emerging fields of AI guided 3D Printing, 3D Bioprinting, Digital and Robotics aided Additive Nano-Manufacturing, Flexible Organic and Printed Electronics, Healthcare, Nanomedicine, Wearables, Automotive, etc. and for the fabrication of novel nanomaterials in advanced device architectures.

As the world of 3D Printing and Additive Nano-Manufacturing is evolving, it revolutionizes the manufacturing of Electronics providing unprecedented functionalities. Functional elements such as sensors, biosensors, and switches are now being integrated into 3D printed products, paving the way for exciting new markets, applications, and opportunities.

3D Printing also revolutionizes large scale manufacturing processes (primarily additive) combining Artificial Intelligence and Machine Learning Algorithms to create novel products by digital production methods with minimum material/energy waste, cost and environmental impact. Also, this Conference connects the Manufacturing with nano aspects and In-Line and Real-Time Monitoring Process and Control approaches to enable low-cost and high-volume manufacturing of Advanced Materials, and Organic Electronic Devices.

International Organizing Committee (tentative)

L. Moroni, Maastricht University, The Netherlands
E. Delivopoulos, University of Reading, UK
E. Giannelis, Cornell University, USA
N. Li Pira, Centro Ricerche Fiat, S.C.p.A, Italy
S. Logothetidis, Department of Physics, Aristotle University of Thessaloniki, Greece
S. Magdassi, Hebrew University of Jerusalem, Israel
Y. Misirlis, University of Patras, Greece
A. Sendemir, Ege University, Turkey
P. Shastri, University of Freiburg, Germany

Co-Organized by:

realnano logo H2020 REALNANO: "In-line and Real-time digital nano-characterization technologies for the high yield manufacturing of Flexible Organic Electronics
www.realnano-project.eu
   
musicode logo EU H2020-MUSICODE: "An experimentally-validated multi-scale materials, process and device modelling & design platform enabling non-expert access to open innovation in the Organic and Large Area Electronics Industry"
www.musicode.eu
   
ff2s logo EU H2020-FlexFunction2Sustain: "Open Innovation Ecosystem for Sustainable Nano-functionalized Flexible Plastic and Paper Surfaces and Membranes"
www.flexfunction2sustain.eu
   
nanomecommons logo EU H2020-nanoMECommons: "Harmonisation of EU-wide nanomechanics protocols and relevant data exchange procedures, across representative cases; standardisation, interoperability, data workflow (nanoMECommons)"
www.nanomecommons.net
   
smartline logo EU H2020-SMARTLINE: "Smart In-line metrology and control for boosting the yield and quality of high-volume manufacturing of Organic electronics
www.smartline-project.eu
   
cornet logo EU H2020-CORNET: "Multiscale Modelling and Characterization to optimize the Manufacturing processes of Organic Electronics materials and devices
www.cornet-project.eu

 

Disclaimer and Scam Information:
The NANOTEXNOLOGY 2022 Organizing Committee has been informed that third-party companies, pretending to be acting on behalf of the Organizers, have contacted the event speakers and attendees via telephone calls and emails requesting information for the payment of their registration fees and/or their accommodation.
We kindly ask you to DISREGARD these messages and to NOT proceed to any arrangement or payment to these third-party companies, because they do not represent in any way the Organizers.
The Organizers have not authorized any third-party entity to contact participants, attendees or exhibitors, regarding their registration and accommodation nor to distribute or sell attendees lists related to NANOTEXNOLOGY events. Please trust only the information and instructions at the Official NANOTEXNOLOGY 2022 website and the messages you receive only by the Organizing Committee. In case you receive a suspicious call or email, we kindly ask you to inform us.
Under no circumstances shall the Organizers be held liable or responsible for any claims, losses, damages, expenses or other inconvenience resulting from the actions of these third-party companies.

 

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Organized by

ltfnauth_logo hope-a nanonetrealnano logoff2s logonanomecommons logomusicode logosmartline logocornet logo

Supported by

ECh2020 logophysicsPRAXI.logocornelllogo U2BX1 UCBerkeley-text-logohzbazkportopalace logo

Under the Auspices of

mindev logo ypen logo mathra logo gsri logo minedu logo ggdos logo sci auth logo physics auth logo