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NANOTEXNOLOGY 2022 will be a Hybrid multi-event, combining Live (On-site) and Virtual (On-line) presentations and participation.

3-6 July 2023
3-6 July 2023

16th Int. Symposium on Flexible Organic Electronics
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5-6 July 2023
5-6 July 2023

6th Int. Conference on 3D Printing, AI, Manufacturing
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3-7 July 2023
3-7 July 2023

13th Int. Exhibition on Nanotechnologies, Organic Electronics & Nanomedicine
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4-7 July 2023
4-7 July 2023

20th Int. Conference on Nanosciences & Nanotechnologies
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1-8 July 2023
1-8 July 2023

17th Int. Summer Schools on Nanotechnologies
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4-6 July 2023
4-6 July 2023

Business Forum and
Matchmaking Event
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CONFERENCE DATES

1-8 July 2023

EXPO DATES

3-7 July 2023

EARLY REGISTRATION DEADLINE

19 May 2023

ABSTRACT SUBMISSION DEADLINE

31 March 2023

Welcome to NANOTEXNOLOGY 2023

We are pleased to invite you to NANOTEXNOLOGY 2023, 1 - 8 July 2023, Thessaloniki, Greece

NANOTEXNOLOGY is the largest technology, networking and matchmaking annual event in Europe and it includes the premier and Internationally established events:

NANOTEXNOLOGY explores the opportunities in the emerging fields of Nanotechnologies, Organic & Printed Electronics and Nanomedicine. NANOTEXNOLOGY brings together over 2,000 researchers, scientists, engineers, business, technical and policy professionals to promote research and industrial collaborations, identify priorities and strengthen the innovation ecosystem.

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BROCHURES

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Some of NANOTEXNOLOGY 2023 Invited Speakers

 anthopoulos Thomas Anthopoulos
King Abdullah University of Science and Technology, Saudi Arabia
 anthopoulos Thomas Kolbusch
COATEMA Coating Machinery GmbH, Germany
 stingelin Natalie Stingelin
Georgia Institute of Technology, USA
 torsi Luisa Torsi
University of Bari Aldo Moro, Italy
 anthony John Anthony
University of Kentucky, USA
 asadi Kamal Asadi
University of Bath, UK
 biscarini Fabio Biscarini
Italian Institute of Technology/Uni. of Modena and Reggio Emilia, Italy
 christou Aristos Christou
University of Maryland, USA
 davino Gabriele Davino
Institut Neel, CNRS, France
 king Sir David King
Founder & Chair, Centre for Climate Repair at Cambridge Uni., UK
 gkoupidenis Paschalis Gkoupidenis
Max Planck Institute for Polymer Research, Germany
 hauser Charlotte Hauser
King Abdullah University of Science and Technology, Saudi Arabia
 mekeridis Evaggelos Mekeridis
Organic Electronic Technologies (OET), Greece
 minev Ivan Minev
University of Sheffield, UK
 widera Darius Widera
University of Reading, UK
 de-angelis Francesco De Angelis
Italian Institute of Technology, Italy
 milosevic Ivanka Milosevic
University of Belgrade, Serbia
 harmandaris Vangelis Harmandaris
The Cyprus Institute, Cyprus
 arenal Raul Arenal
University of Zaragoza, Spain
 feitshans Ilise Feitshans
European Scientific Institute, France
 missirlis Yannis Missirlis
University of Patras, Greece
 damnjanovic Milan Damnjanovic
University of Belgrade, Serbia
 skabara Peter Skabara
University of Glasgow, UK
 ackermann Jorg Ackermann
CNRS, France
 campagna Dario Campagna
ESTECO SpA, Italy
 deligeorgis George Deligeorgis
FORTH IESL, Greece
 georgiadou Dimitra Georgiadou
University of Southampton, UK
 ledieu Julian Ledieu
Institut Jean Lamour, Uni. of Lorraine-CNRS, France
 nomine Alexandre Nomine
University of Lorraine, France
 journet-gautier Catherine Journet-Gautier
Claude Bernard University Lyon 1, France
 eniola-adefeso Lola Eniola-Adefeso
University of Michigan, USA
 maser Wolfgang Maser
Institute of Carbochemistry (ICB-CSIC), Spain
 fillon Bertrand Fillon
CEA/DRT, France
 menda Ugur Deneb Menda
NOVA School of Science and Technology, Portugal
 delivopoulos Evangelos Delivopoulos
University of Reading, UK
 alvarez-lorenzo Carmen Alvarez Lorenzo
University of Santiago de Compostela, Spain
 kneer Aron Kneer
TinniT Technologies GmbH, Germany
 keivanidis Panagiotis Keivanidis
Cyprus University of Technology, Cyprus
 sendemir Aylin Sendemir
Ege University, Turkey
 claypole Timothy Claypole
Welsh Centre for Printing and Coating, Swansea Uni., UK
 sarakinos Kostas Sarakinos
University of Helsinki, Finland
 heeney Martin Heeney
King Abdullah University of Science and Technology, Saudi Arabia
 ciocca Manuela Ciocca
University of Bozen-Bolzano, Italy
 demadrillle Renaud Demadrille
Interdisciplinary Research Institute of Grenoble, CEA, France
 tanaka Masaru Tanaka
Kyushu University, Japan
 teshima Katsuya Teshima
Shinshu University, Japan
 volonakis George Volonakis
University of Rennes 1, France
 wang Lisheng Wang
University of Ottawa, Canada
 so Franky So
North Carolina State University, USA
 shastri Prasad Shastri
University of Freiburg, Germany
 salzmann Ingo Salzmann
Concordia University, Canada
 kioseoglou Joseph Kioseoglou
Aristotle University of Thessaloniki, Greece
 puzyn Tomasz Puzyn
QSAR Lab Ltd., Poland
 djenizian Thierry Djenizian
MINES Saint-Etienne (EMSE), France
 grammatikopoulos Panagiotis Grammatikopoulos
Guangdong Technion-Israel Institute of Technology, China
 vattuone Luca Vattuone
University of Genoa, Italy
               
               

Sponsors

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Exhibitors

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Disclaimer and Scam Information:
The NANOTEXNOLOGY 2023 Organizing Committee has been informed that third-party companies, pretending to be acting on behalf of the Organizers, have contacted the event speakers and attendees via telephone calls and emails requesting information for the payment of their registration fees and/or their accommodation.
We kindly ask you to DISREGARD these messages and to NOT proceed to any arrangement or payment to these third-party companies, because they do not represent in any way the Organizers.
The Organizers have not authorized any third-party entity to contact participants, attendees or exhibitors, regarding their registration and accommodation nor to distribute or sell attendees lists related to NANOTEXNOLOGY events. Please trust only the information and instructions at the Official NANOTEXNOLOGY 2023 website and the messages you receive only by the Organizing Committee. In case you receive a suspicious call or email, we kindly ask you to inform us.
Under no circumstances shall the Organizers be held liable or responsible for any claims, losses, damages, expenses or other inconvenience resulting from the actions of these third-party companies.

 

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Organized by

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Supported by

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Under the Auspices of

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